Events

The 15th Annual Intellectual Property Conference – Navigating Innovation and IP Amid Global Turbulence

Date:

27 Jun 2023 - 29 Jun 2023

Time:

27 June 2023: Pre-Conference Workshop (9:00 am – 5:00 pm)

28 June 2023: Conference (9:00 am – 6:00 pm)

29 June 2023: Conference (10:00 am – 6:00 pm)

Venue:

Graduate Law Centre 2/F, Bank of America Tower, 12 Harcourt Road Central, Hong Kong

Admission:

Register here for the 15th Hong Kong IP Conference.

Register here for Pre-Conference Workshop.

Event Details:

Rapid changes are underfoot in the world of IP innovation, but how do creators and businesses protect, promote and sell their ideas when global tensions are high? There are now wars and cold wars to consider as the world rolls out ChatGPT, EV advancements, …. Instead of collaborating, some countries seem to be going back to home-growing their technology. The U.S. has stopped many tech transfers to China, while China’s central political committee recently listed self-innovation as one of its 5 focal points. If everyone is trying to keep technological development close to home from beginning to end, how can intellectual assets be distributed? Will inflation limit the amount of financial investments in the IP space, or is IP possibly the one investment that can save us? With political leadership changes, the U.S. Patent Eligibility Restoration Act of 2022 may likely pass, limiting what may be eligible for a patent. Travel has opened up, but pandemic supply-chain disruptions remain. We will explore the possibilities in this new world order as well as how the innovation engine can maintain its steam in the ever-evolving digital and virtual world.

The 15th Annual Intellectual Property Conference – Navigating Innovation and IP Amid Global Turbulence

Remarks:
  1. Co-organizers: The Centre for Legal Innovation and Digital Society (CLINDS), Kinect Law, United States-China Intellectual Property Institute, Inc. (USCIPI), Asia Innovation and IP Society Limited (AIIPS)
  2. CPD credit is available upon application and subject to accreditation by the Law Society of Hong Kong (currently pending).
  3. Language: English